A crucial tool for the deposition of nanostructured thin films is thermal vapor deposition. The technique is explained in detail in this study. This describes the physical vapor deposition process used to build a thin layer of copper oxide on a silicon substrate. The average thickness of physical vapor deposition is 2 to 5 microns, and it is a family of deposition procedures where we evaporate our sample and deposit that via condensation onto a substrate. X-Ray diffraction (XRD), field emission scanning electron microscopy (FESEM), Photoluminescence and UV-Vis were used to characterize these films.

Keywords: FESEM, XRD, Nanostructured Thin Films, Copper Oxide, Silicon Substrate.